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us for further information!
Etch Stops

Shown are Single side Polysulfone Vacuum Etch Stop for 4” wafers.  This Etch Stop
features double "O" ring seal, vacuum connection.  Other sizes are available for
processing 1 ea. 4” to 2 ea. 8” wafers).  

Also available are double sided etch stops.
PROCESS TECHNOLOGY ETCH TECHTM SERIES, CASCADE PROCESS
BATH for KOH process:
Non-breakable PFA tank. For use with integral in-tank
heater or external inline heater.

Specifications:
Capacity:
Two 4", 5", 6", 8" (100, 125, 150, 200 mm) cassettes, One 8" (200mm) cassette
Temperature range: Up to 180º C dependent on chemistry.
Design:
  • Unbreakable PFA inner and outer tanks.
  • Inner tank sparger rails provides even chemical dispersion and false bottom on which carriers
    are set.
  • Inner tank walls have serrated edges to prevent whirlpools.
  • The fluoropolymer mid-frame assembly is suspended from the top deck for easy leveling of the
    process tank. This ensures uniform cascading of the chemistry.
  • Outer PFA weir for enhanced chemical and heat distribution.
  • Halar coated stainless steel outer structure for strength and rigidity.
  • PTFE top deck assembly for added structural support.
  • Air diverter located in the outer weir to prevent the formation of air pockets around the heater.
Standard features:
  • Process thermocouple port  • Outer weir thermocouple port  • Liquid level port for N2 bubble
    sensor
  • System overflow connection  • Drain connection  • Process tank leveling adjustments
  • Flaretek® inlet connections for remote pump
  • Refluxor and cover (not shown)

Heater voltages available: 120 to 600 volts, single or three phase
Options:
  • Tank system can be integrated with existing control systems  
  • PID or PLC Process Controller
  • Integral fluoropolymer immersion heater and/or in-line heater (fluoropolymer or quartz available).
  • Chemical dispensing manifold
  • Custom interfacing to match existing system
  • Manual, pneumatic or hydraulic operated lid  
  • In-line filter chamber
  • Custom fitting of tank to match existing system
  • Additional ports for level sensing and automatic chemical fill  • Wafer locater nest
Shown Process Technology Etch Tech, not shown
refluxor (condensing head with cover)
OUR STATIC KOH CONSTANT TEMPERATURE BATHS are available in a wide
variety of configurations. They are engineered to reliably and efficiently heat KOH or
similar chemistries.  Operating temperatures range from sub-ambient to 185 degrees
Celsius.

Standard features:  
  • Teflon immersion heater with integral overtemperature thermocouple.
  • J-Type Process thermocouple (if Process Controller is ordered)
  • Liquid level sensor (if Process Controller is ordered)
  • Teflon process tank
  • Refluxor (condensing head) with cooling coils and hinged cover.
  • Process Controller with integral timer

Specifications:
Capacity:
  • Two ea. 4", 5, 6, 8 (100, 125, 150. 200 mm) cassettes
  • One ea. 4", 5, 6, 8 (100, 125, 150. 200 mm) cassette
Options:
  • Halar tank
  • Custom size (interior dimensions, size and number of cassettes).
  • Drain valve or drain adapter (connection)
  • Magnetic Stirrer, N2 Bubbler
  • Custom Covers (lift off, pass-thrus for etch stop connections), Refluxors
  • Voltage, phase.
  • Custom Process Controllers with / without timers
Shown: Static KOH Teflon process bath with Process Controller
refulxor and cover, 1 ea. 6" cassette capacity
SHOWN DR SERIES QUICK DUMP RINSER, Designed specifically for MEMS
processes. It features a programmable cascade feature and misting spray nozzles to
effectively rinse fragile MEMS devices.  MCDR-M Series options include PP or PVDF
construction, Rinse to Resistivity System and N2 bubbler.

Our Quick Dump Rinsers and Cascades are available in a wide variety of configurations.
They are engineered to improve the quality and effectiveness of your rinse process.

Standard features:  2 ea. spray bars, 2 ea. DI water valves, 1 or 2 ea. dump valves (dependent on
size ordered), drop away cover.
Specifications:
Capacity:
  • Two ea. 4", 5, 6, 8 (100, 125, 150. 200 mm) cassettes
  • One ea. 4", 5, 6, 8 (100, 125, 150. 200 mm) cassette
Material of construction:  Polypropylene of PVDF (dependent on model ordered)
Options include:
  • Material of construction  - Wetted materials include Teflon, PVDF, and polypropylene etc.
  • Process applications include cold and hot DI rinse
  • Interior dimensions, wafer cassette capacity (size and number of cassettes)
  • Single or reclaim double door (applies to Quick Dump Rinsers only)
  • Multiple rinse stages / wells (applies to Cascades only)
  • N2 Bubbler
  • Covers (Hinged  - lift off)
  • Voltage, phase
  • Controller
Shown:  Polypropylene M Series QDR with  
QDR Controller, drop down cover, 2 ea. 6"
cassette capacity
Photo courtesy of Dr. Scott Collins,
University of Maine
Photo courtesy of Dr. Scott Collins,
University of Maine
Shown at left:  Example
MEMS Universal Anisotropic
Process Station Layout (6’)
Integral Systems Engineering, Inc.
MEMS PROCESS
TOOLS
PRODUCTS
Call: 530.757.1517
ISE
1244 Commerce Ave
Woodland, CA 95776
tel  530.757.1517
fax  530.757.2008
For additional information
on any of our products or
services please contact
us @
info@iseint.com or
call 530.757.1517
(8:30AM-5PM PST)